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Plate

Name Plate
Description High strength, low warpage, good toughness, electrically conductive, high thermal and mechanical capacity easily machined, very good chemical resistance.
Material PEEK ELS NANO
Size 20 mm
Application Semiconductor technology - vacuum wands, wafer baskets, wafer carrier, distance parts, gripper fingers and gears, ultra pure water systems-bearing bushes, levers, friction rings, ball bearing housing, bearing rings.
Additive Carbon Fiber Reinforced, Electrically Conductive


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